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Sunshine Ultrasonic Vibration Processing Machine

Sunshine Ultrasonic Vibration Processing Machine

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Sunshine Ultrasonic Vibration Machining Systems: Revolutionize Hard Material Processing

Keywords: Ultrasonic Assisted Machining, Ultrasonic Vibration Cutting, Hard Material Machining, Precision Machining, Tool Life Extension, Surface Quality Improvement

Unlock Unprecedented Capabilities in Precision Machining

Sunshine Ultrasonic Vibration Machining Systems represent a groundbreaking leap forward in the processing of hard, brittle, and difficult-to-machine materials. By integrating high-frequency ultrasonic vibration directly into the cutting tool, our systems fundamentally transform the machining process, delivering superior results unattainable with conventional methods. Experience the future of precision manufacturing.

Core Technology: How Ultrasonic Assisted Machining Works

Our systems drive the cutting tool to perform high-frequency vibrations at 20,000 to 50,000 cycles per second (20-50 kHz). This rapid oscillation imparts incredible accelerations (up to 100,000 g) to the tool tip. Crucially, when the tool contacts the workpiece, it processes the material through high-frequency micro-impact cutting, operating in an intermittent separation mode.

  • Reduced Effective Cutting Time: The tool is completely separated from the workpiece for over 70% of each vibration cycle.

  • Dramatically Reduced Friction & Heat: This separation drastically lowers friction, significantly reducing heat generation at the cutting zone.

  • Lower Cutting Forces: Cutting resistance is substantially minimized.

  • Optimized Cutting Performance: The unique cutting mechanics allow the tool's performance to be fully realized, enhancing efficiency and quality.

Key Product Features & Advantages

  • Dual-Mode Capability: Seamlessly switch between Ultrasonic Vibration Machining and Ordinary Cutting Processing on a single platform.

  • Unmatched Efficiency & Quality:

    • Improves Processing Efficiency: Faster material removal rates on hard materials.

    • Extends Tool Life Significantly: Reduced friction and heat drastically decrease tool wear.

    • Improves Workpiece Surface Quality: Achieves exceptional surface finishes with minimal subsurface damage.

    • Reduces Cutting Force: Lower energy consumption and reduced stress on machine components.

    • Reduces Cutting Temperature: Protects workpiece integrity and minimizes thermal distortion.

    • Reduces Surface & Sub-Surface Damage: Produces parts with superior structural integrity.

    • Reduces Surface Residual Stress: Minimizes post-machining distortion and improves part stability.

  • Precision Engineering: High Position Accuracy (0.003-0.004mm) ensures micron-level precision.

  • Adjustable Vibration: Fine-tune Vibration Amplitude (1-15μm) for optimal results across different materials and operations.

  • Stable High-Speed Operation: Preset dynamic balance (G1.5) enables smooth running up to 30,000 RPM.

  • Robust Power: Output Power (5-500W) provides ample energy for demanding applications.

  • Customizable: Standard 3-Axis Travel (600x500x270mm), with 4-Axis and 5-Axis configurations and custom travels available.

Technical Specifications Summary

Feature Specification
Vibration Frequency 20 kHz - 50 kHz
Driving Voltage 10 V - 500 V
Rated Current 4 A
3-Axis Travel (XYZ) 600 x 500 x 270 mm (Customizable)
Position Accuracy 0.003 mm - 0.004 mm
Vibration Amplitude 1 μm - 15 μm (Adjustable)
Dynamic Balance G1.5 @ 30,000 RPM
Output Power 5 W - 500 W
Max Spindle Speed 30,000 RPM
Customization 4-Axis, 5-Axis, Travel Dimensions

Target Materials & Applications

Sunshine Ultrasonic Systems excel at machining a vast array of challenging materials, including:

  • Advanced Ceramics: Silicon Carbide (SiC), Zirconia (ZrO2), Alumina (Al2O3), Boron Carbide (B4C), Silicon Nitride (Si3N4), Aluminum Nitride (AlN)

  • Hard Alloys: Tungsten Carbide (WC)

  • Brittle Materials: Glass, Sapphire

  • Composites: Ceramic-based Fiber Composites, Graphite

These capabilities drive innovation across critical industries:

  • 3C Electronics: Precision components for smartphones, laptops, wearables.

  • Semiconductor: Wafer handling, ceramic substrates, precision parts.

  • Aerospace & Defense: Advanced ceramic components, composites, hardened alloys.

  • Medical Devices: Biocompatible ceramics (implants, surgical tools), microfluidic chips.

  • Automotive & New Energy: EV battery components, sensors, lightweight composites.

  • Chemical Processing: Corrosion-resistant ceramic parts.

  • Microfluidics: Precise micro-channels and features.

Frequently Asked Questions (FAQ)

  1. Q: What is the main advantage of Ultrasonic Assisted Machining (UAM)?

    • A: UAM drastically reduces cutting forces, heat generation, and tool wear while significantly improving surface finish and enabling the machining of extremely hard, brittle materials impossible to process effectively with conventional methods.

  2. Q: How does UAM extend tool life?

    • A: By ensuring the tool contacts the workpiece intermittently (>70% separation time), friction and heat are minimized. This reduces abrasive wear, adhesion, and thermal degradation of the cutting edge.

  3. Q: What materials benefit most from UAM?

    • A: Hard, brittle ceramics (SiC, Al2O3, ZrO2, Si3N4, AlN, B4C), glass, sapphire, tungsten carbide, and ceramic composites see the most dramatic improvements in machinability, surface quality, and reduced damage.

  4. Q: Can your machine operate without ultrasonic vibration?

    • A: Yes! Our systems are All-in-One Machine Tools, seamlessly switching between Ultrasonic Vibration Machining mode and Ordinary Cutting Processing mode, offering maximum flexibility.

  5. Q: Is the vibration amplitude adjustable?

    • A: Absolutely. The vibration amplitude is precisely adjustable within the range of 1 to 15 micrometers (μm), allowing optimization for different materials, tool types, and desired surface finishes.

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